While Semiconductor Insights is currently analyzing the MSM6800, it's important to look at devices that have successfully been adopted in consumer products. The Qualcomm MSM6100 is an efficient, feature-rich part that's driven by several powerful processing cores ((Fig. 2). An ARM926EJ-S and two QDSP4000 DSPs provide considerable processing ability and are supported by a large amount SRAM and ROM. By using a stacked-die approach, Qualcomm elected to use the smaller secondary die for analog circuitry while concentrating on the efficient placement of digital circuitry on the larger main die. In the KP4000 specifically, the MSM6100 connects to Elpida TY8000B410BMGF mobile RAM and a 1-Gbit Toshiba NAND flash memory.
To operate both the transmit and receive portions of the handset, LG chose to continue the use of Qualcomm devices with the RFT6100 and RFR6000. It's typically not a difficult decision to remain with the same vendor for various inter-related components for a few reasons. First, it's often possible to get better pricing when you're purchasing multiple components. Second, the parts are all designed to work together, so reference designs will be available, reducing the handset's time to market. As well, the components can be optimized, typically resulting in a smaller form factor. This also includes enhancing the functionality without difficulty, such as GPS location. Finally, support will be easier, as one call should be sufficient to find an applications engineer familiar with all of the associated components.
Sunday, April 18, 2010
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